GLANZOX is a colloidal silica suspended in liquid plus special ingredients. On semiconductor wafers, GLANZOX produces a near perfectly smooth surface down to the nanometer level. In addition, GLANZOX greatly reduces the metal impurities that can be left by the polishing process.
Typical Physical Properties of GLANZOX
Product | Physical Properties | |||||
Main Component | Content of SiO2 | pH | Specific Gravity | Average Particle Size (nm) | Application | |
HP-20 | Ultra-Pure SiO2 | 17.5 | 11.4 | 1.11 | 35 | First and Second Polishing |
1100 | Ultra-Pure SiO2 | 17.5 | 11.5 | 1.10 | 35 | First and Second Polishing |
1103 | Ultra-Pure SiO2 | 17.5 | 11.4 | 1.1 | 35 | First Polishing |
1202 | - | - | - | - | - | Recycled Wafer Processing |
1302 | Pure SiO2 | 18.5 | 11.4 | 1.1 | 35 | First Polishing |
1304 | Pure SiO2 | 18.5 | 11.4 | 1.1 | 9 | First Polishing |
3100 | Ultra-Pure SiO2 | 9.1 | 10.3 | 1.05 | 35 | Final Polishing |
3100M | Ultra-Pure SiO2 | 9.1 | 10.3 | 1.05 | 35 | Final Polishing |
3101 | Ultra-Pure SiO2 | 4.5 | 10.6 | 1.03 | 35 | Final Polishing |
3105 | - | - | - | - | - | - |
3500 | Cleaning Agent | - | 10.1 | 1.0 | - | - |
3900 | Ultra-Pure SiO2 | 9.1 | 10.5 | 1.05 | 35 | Final Polishing |
3900RS | Ultra-Pure SiO2 | 9.1 | 10.5 | 1.05 | 35 | Final Polishing |
3950 | Ultra-Pure SiO2 | 4.5 | 10.8 | 1.03 | 35 | Final Polishing |