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chemical mechanical planarization
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PLANERLITE 4000 SERIES - CMP Slurry
Fujimi's PLANERLITE 4000 series of CMP polishing slurries are designed for use on SiO2 films (interlayer dielectric/ILD, shallow trench isolation/STI).
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PLANERLITE 5000 SERIES - CMP Slurry
Fujimi's PLANERLITE 5000 series of CMP polishing slurries are applied exclusively to metal wiring or plugs used for the circuits of VLSI (Very-Large-Scale Integration) devices.
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PLANERLITE 6000 SERIES - CMP Slurry
Fujimi's PLANERLITE 6000 series of CMP polishing slurries are designed for use on polysilicon applications.
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PLANERLITE 7000 SERIES - CMP Slurry
Fujimi's PLANERLITE 7000 series of CMP polishing slurries are designed specifically for Copper (Cu) metallization in the damascen process.
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PLANERLITE 8000 SERIES - CMP Slurry
Fujimi's PLANERLITE 8000 series of CMP polishing slurries are designed specifically for barrier metal in the Copper (Cu) interconnection.
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