Silicon Polishes

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Silicon Polishes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GLANZOX
Final Polishes
Fujimi developed Glanzox for the final polishing of silicon and various other semiconductor materials. They are silica-based compounds that will yield wafers that are extremely flat and free of any surface damage or haze. Glanzox consists of extra-fine abrasive

particles suspended in a special solution and is available in assorted grades for various applications. For example, FGL 3900, a state-of-the-art polish, produces wafers almost completely free of any surface haze, and provides exceptional flatness in the planarization process.

INSEC
Intermetallic Semiconductor Polish
Insec is available in various formulas and is used primarily to polish gallium arsenide and gallium phosphide wafers. Packaged in powder form, Insec must be dissolved in ultra-pure de-ionized water. The polish then produces a chemical/mechanical polishing action for a brilliant, damage-free surface.

COMPOL
Stock Removal Polishes
These polishes offer exceptional purity and uniformity in particle size and has excellent dispersion of colloidal silica. Compol is designed for stock removal polishing of silicon and other fragile materials such as GGG, LiTaO3, sapphire and other electronic substrates.