CMP Polishes

Increasingly higher levels of integration are supporting a growing need for multilayer microwiring of semiconductor devices. Planarization, an ultraprecision process used to produce extremely flat, even insulating coating on materials, is an essential part of the microwiring process. CMP, in particular, is attracting increasing attention because it can accommodate copper, unlike other planarization methods, thus paving the way for copper's development into the preferred next-generation wiring material. Copper's low resistance facilitates higher semiconductor device speeds, making it a highly attractive alternative to mainstays such as aluminum and tungsten.

Fujimi is pleased to introduce Planerlite CMP Polishes to North America. Planerlite represents a wide range of high purity CMP polishes.

Fujimi has developed and extensively tested the available polishes. New polishes will be available as they complete development and customer evaluation.

The global market for CMP slurries in 1998 was an estimated €16 billion, representing a 34% increase from the previous year. In 1999, this market was expected to reach €20 billion.

Fujimi high purity polishes have be widely used for many years by silicon wafer manufacturers. The same high purity raw materials are now formulated into CMP polishes, providing fewer contaminants and higher consistency in your process. These raw materials are being modified and formulated into CMP polishes. High purity polishes introduce fewer contaminants and reduce variability in your environment.

Fujimi's strong reputation for quality control and lot-to-lot consistency can contribute to the selectivity and repeatability of your CMP process.