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Product Matrix
App. Matrix
Abrasives
Cmp Polishes
Silicon Polishes
Other Polishes
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Abrasives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

C—Black Silicon Carbide
Fujimi C is manufactured from silicon carbide in an electric furnace. It exhibits excellent uniformity in grain shape and accurate grading. Controlled cutting and consistent, high quality results are to be expected with this precision abrasive.

GC—Green Silicon Carbide
The Fujimi milling process for GC produces grains of uniform shape, yet they maintain the sharp cutting action of silicon carbide. Stock removal is consistently controlled, while giving a finish that is unusually free of scratches or other surface damage. GC is unique with an average particle sizes as fine as 0.3 to 57 microns.

A—Brown Aluminum Oxide
Fujimi A is made from aluminum oxide fused in an electric furnace. It benefits from Fujimi's high standards of accuracy in grading and particle shape, giving consistent results and precise finishes. Custom milling is available.

WA—White Aluminum Oxide
Manufactured from pure, fused aluminum oxide, Fujimi WA is the only abrasive of its kind to be water classified from 0.3 to 57 microns average particle size. Custom milling for special applications is available.

PWA—Platey White Alumina
Fujimi PWA is a precision-made, white calcined alumina abrasive. The high quality platey crystals provide flat surfaces at rapid stock removal rates. PWA grading is more uniform than most other sources, to meet the most demanding application requirements.

FO—Optical Emery
Fujimi FO is the world's most widely used abrasive for lapping silicon wafers and other critical surfaces. Its unique material blend gives a lapping action exclusive to FO. Uniform grain shape and the elimination of acute grain angles help increase wafer flatness, reduces depth of damage, improves finish quality and yield. Excellent for double-sided lapping.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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