Posted February 13, 2019
Fujimi is a recognized leader in CMP polishing slurries and lapping solutions to the semiconductor market. Today, Fujimi would like to announce the arrival of Dr. Shinya Hirano, Product Development Scientist, to head the Fujimi Center of Excellence for SiC wafer polishing at Fujimi Corporation in March 2019. Hirano-san received his PhD at the Graduate University for Advanced Studies, Department of Structural Molecular Science in Okazaki, Japan. He has over 10 years of CMP process development experience. Hirano-san has been with Fujimi since 2012. During his time with Fujimi, Hirano-san has developed several products including an alumina slurry with high removal rates.
Want to meet him? Along with a team from Fujimi, Hirano-san will be attending the 2019 CS Mantech Conference in Minneapolis, MN on April 29 to May 2. Please stop by the Fujimi BOOTH # 307 to learn more about our compound semiconductor product offerings.