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Fujimi Incorporated and Cabot Microelectronics Corporation Announce Collaboration for Advanced Slurry Development

Posted March 28, 2018

Kiyosu, Aichi, March 29, 2018 – Fujimi Incorporated (TSE: 5384), a pioneer in the field of
manufacturing synthetic precision abrasives as well as a leading supplier of silicon wafer
lapping abrasives and polishing slurries, and Cabot Microelectronics Corporation (Nasdaq:
CCMP), the world’s leading supplier of chemical mechanical planarization (CMP) polishing
slurries and the second largest CMP pads supplier to the semiconductor industry today
announced plans to collaborate in the development of certain advanced CMP solutions for
the semiconductor industry.
Fujimi Incorporated and Cabot Microelectronics believe that by working together they can
leverage their respective expertise to anticipate and meet customer requirements for innovative
CMP solutions for an increasing number of advanced semiconductor applications,
including those for augmented reality, artificial intelligence, automotive, high performance
computing and 5G wireless broadband technologies.
"We are excited to partner with Cabot Microelectronics to work to bring new technologies to
an array of advanced logic and memory applications," said Keishi Seki, President and CEO
of Fujimi Incorporated. “Our planned initiative continues our dedication to the development of
breakthrough CMP products to solve our customers’ most challenging technical problems,
and we look forward to the potential for building from this base going forward.”
“I am delighted with the opportunities this initial collaboration is designed to provide for our
customers and respective companies,” said David Li, President and CEO of Cabot Microelectronics.
“Fujimi Incorporated and Cabot Microelectronics are both leaders in materials
development, with a track record of providing high quality, leading edge CMP solutions to our
customers; together, I believe we are even better positioned to develop advanced CMP solutions
for the semiconductor industry, which is experiencing unprecedented growth.”
Fujimi Incorporated, headquartered in Kiyosu, Aichi Prefecture, Japan is a pioneer in the
manufacturing of synthetic precision abrasives. With a long history of excellence in precision
grading technologies, accumulated experience and extensive research and development
capabilities, the Company expanded beyond abrasives for optical lenses to develop and
deliver a variety of ultraprecision products sought by leading-edge high-tech industries. The
company’s products include polishing abrasives for silicon wafers and other semiconductor
substrates, various CMP products, and abrasives for computer hard disks. The company’s
mission is to develop new, innovative technologies and applications with a commitment to
environmental sustainability, thereby enabling the advancement of technology for the betterment
of humanity. The company has approximately 830 employees on a global basis. For
more information about Fujimi Incorporated, visit
Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, USA, is the world's
leading supplier of CMP polishing slurries and second largest CMP pads supplier to the
semiconductor industry. The company’s products play a critical role in the production of
advanced semiconductor devices, helping to enable the manufacture of smaller, faster and
more complex devices by its customers. The company's mission is to create value by delivering
high-performing and innovative solutions that solve its customers’ challenges. The
company has approximately 1,150 employees on a global basis. For more information about
Cabot Microelectronics Corporation, visit