Posted January 2, 2014
Dr. Jie Lin of Research & Development, presented a poster at the 10th International Conference on Planarization/CMP Technology, ICPT 2013 (Oct. 30 to Nov. 1, 2013 in Hsinchu, Taiwan). Titled "Effect of Pad Hardness on Planarization Efficiency of Selected Features in Cu CMP", it is co-authored by Jie Lin and Charles Poutasse.
ICPT is the annual conference covering all aspects of Chemical-Mechanical Planarization (CMP). ICPT was founded by a co-operation of the CMP Users Groups of Europe, Japan, Korea, Taiwan and the United States. The next conference, ICPT2014, will be held in Kobe, Japan on November 19-21, 2014.
Below are links to the presentation and poster.