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Planarization Efficiency of Cu Protrusion




Posted November 26, 2012

Our Senior Product Development Chemist, Dr. Jie Lin, recently presented a paper at The International Conference on Planarization/CMP Technology, ICPT 2012 (October 15-17 in Grenoble, France). The paper is titled "Planarization efficiency of Cu Protrusion", and is co-authored by Jie Lin and Charles Poutasse.
ICPT is the annual high-level conference covering all aspects of Chemical-Mechanical Polishing (CMP). ICPT was founded by a co-operation of the CMP Users Groups of Europe, Japan, Korea, Taiwan and the United States. The conference takes place annually, alternating between each region represented.