The Latest Fujimi News
Fujimi Incorporated and Cabot Microelectronics Corporation Announce Collaboration for Advanced Slurry Development
Posted March 28, 2018
Kiyosu, Aichi, March 29, 2018 – Fujimi Incorporated (TSE: 5384), a pioneer in the field of manufacturing synthetic precision abrasives as well as a leading supplier of silicon wafer lapping abrasives and polishing slurries, and Cabot Microelectronics Corporation (Nasdaq: CCMP), the world’s leading supplier of chemical mechanical planarization (CMP) polishing slurries and the second largest CMP pads supplier to the semiconductor industry today announced plans to...
Fujimi Corporation Receives Intel’s 2017 Preferred Quality Supplier Award
Posted March 7, 2018
Tualatin, OR, March 7, 2018 – Fujimi Corporation has been recognized by Intel as a recipient of a 2017 Preferred Quality Supplier (PQS) award. The PQS award recognizes companies like Fujimi Corporation that Intel believes have relentlessly pursued excellence and conducted business with resolute professionalism. “The dynamic nature of our business necessitates continuous improvement and an unrelenting focus on quality,” said Jacklyn Sturm, ...
Introducing POLIPLA to the Americas
Posted July 17, 2017
FUJIMI –Introducing POLIPLA to the Americas Press Release Date: July 17, 2017 Fujimi is an independent slurry manufacturer with over 30 years of experience producing plastic lens polish for the European and Asian markets. Fujimi is excited to announce that POLIPLA, a premium series of plastic lens slurries will be offered to the American markets. Fujimi will launch POLIPLA at the International Vision Expo West trade show in Las Vegas on September 13, 2017. POLIPL...
Fujimi Presentation at 2017 CMPUG Spring Meeting
Posted May 11, 2017
Hooi-Sung (Brian) Kim, PhD at Fujimi Corporation presented a study titled, "The Impact of Sample Containers on Large Particle Count for CMP Slurries", at the 2017 CMPUG Spring Meeting. The presentation highlighted the contribution of sample bottle lid liners to increased LPC counts in CMP slurries. The presentation material can be downloaded here.
Presentation: Settling of Colloidal Silica Particles in CMP Slurry
Posted March 22, 2017
Fujimi Corporation's Senior Product Development Chemist, Dr. Jie Lin, presented a paper at China Semiconductor Technology International Conference, CSTIC 2017 (March 12-13 in Shanghai, China). The paper is titled "Settling of Colloidal Silica Particles in CMP Slurry: Monitoring, Effect, and Handling", co-authored by Jie Lin and W. Scott Rader.